What is BGA?

BGA Reballing Service

BGA is a surface-mount package used for ICs. This high-density package makes it easy to overcome soldering difficulties. BGA, which has low thermal resistance, provides the best performance. BGA Reballing service, which eliminates soldering reflow profile errors and PCB assembly errors and enables re-soldering, is provided by a company working under the best laboratory conditions. The company, which informs you about the replacement of computer spare parts or the necessary procedures, provides services at very affordable prices. The team, which performs stress tests to ensure long-term operation under difficult conditions, makes your device work with the best performance.

Errors Made During BGA Rework

BGA reballing service, performed to prevent potential errors and problems that may arise over time, ensures the re-installation and removal of BGAs. Your device, repaired by professional engineers providing service in ESD-safe soldering laboratories, comes with a 3-month warranty. The company provides secure service by ensuring that certain conditions in the laboratory are met during the repair of the device. You will be notified of updates via e-mail. Errors made during BGA rework assembly and repair can lead to problems such as excessive solder addition, BGA pad damage, incorrect BGA orientation, and solder bridging. Bilgisayarlab.com eliminates problems such as inappropriate equipment selection, insufficient operator training, and heat damage.